B.Tech IV Year II Semester (R16)
Introduction: History of MEMS, market for MEMS, overview of MEMS processes properties of silicon, a sample MEMS process. Basics of Microtechnology: definitions and terminology, a sample process, lithography and etching. MEMS Biosensors: Bio Flow Sensors, MEMS Images. Introduction to MEMS Pro design software.
Micromachining: Subtractive processes (wet and dry etching), additive processes (evaporation, sputtering, epitaxial growth). Fundamental Devices and Processes: basic mechanics and electrostatics for MEMS, parallel plate actuators, pull-in point, comb drives. Fundamental Devices and Processes: more electrostatic actuators; MEMS foundries, Cronos MUMPs (multi user MEMS process). MUMPs Multi User MEMS Process: JDS Uniphase MUMPs processing sequence and design rules. MUMPs and SUMMIT: design rules; applications; micro hinges and deployment actuators.
CMOS MEMS: CMOS foundry processes, integrated IC/MEMS, MEMS post processing, applications. Clean room lab techniques: clean rooms, gowning procedures; safety, fire, toxicity; acids and bases; photolithography. MicroOptoElectroMechanical Systems (MOEMS): micro scanners, digital mirror display, retinal scanning display. Grating light valve, corner cube retroreflector, optical switches, other micro-optical devices.
Thermal Transducers: Bimorphs, “heatuators”, cilia arrays. Piezoresistivity; Scanning Probe Microscopy: scanning tunneling microscope (STM), atomic force microscope (AFM). Scaling Laws. Wireless MEMS: mechanical and electrical resonators, Q-factor, switches, filters. Power for MEMS: thin film batteries, micro fuel cells, energy fields, microfliuds.
MEMS Packaging and Assembly: Micro assembly: serial and parallel, deterministic and stochastic; microgrippers: HexSil process; packaging techniques. The Future of MEMS: bioMEMS – neural implants, gene chips, diagnostic chips; MEMS in space; mechanical computers; invisible and ubiquitous computing.
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