M.Tech I Year II Semester (R17)
Surface treatment: Scope, Cleaners, Methods of cleaning, Surface coating types, and ceramic and organic methods of coating, economics of coating, Electro forming, Chemical vapour deposition, thermal spraying, lon implantation, diffusion coating, Diamond coating and cladding.
Non-Traditional Machining: Introduction, need AJM, Parametric Analysis, Process capabilities, USM- Mechanics of Cutting, models, Parametric Analysis, WJM – principles, equipment, generators, analysis of R-C circuits, MRR, Surface finish, WEDM.
Laser Beam Machining – Principles of working, equipment, Material removal rate, Process parameters, performance characterization, applications. Plasma Arc Machining – Principles of working, equipment, Material removal rate, Process Parameters, performance characterization, applications Electron Beam Machining – Principle of working equipment, Material removal rate, Process performance characterization, applications Electro Chemical Machining – Principle of working, equipment, Material removal rate, Process parameters, performance characterization, applications
Processing of ceramics: Applications characteristics, classification Processing of particulate ceramics, Powder preparations, consolidation, Drying, sintering, Hot compaction, Elastomers, Reinforced plastics, MMC, CMC, Polymer matrix composites.
Fabrication of Microelectronics devices: Crystal growth and wafer preparation, Film deposition oxidation, lithography, bonding and packaging, reliability and yield, Printed Circuit boards, computer aided design in micro electronics, surface mount technology, Integrated circuits economics. E-Manufacturing, nanotechnology, and micromachining, High speed Machining
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