JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD

Course Objectives:

• 1. To know the RAM technologies, architecture and applications
• 2. To know the circuit design concepts of Non-volatile memories
• 3. To understand the Memory package density technologies.

Course Outcomes

At the end of the course, students will be able to:

• 1. Select architecture and design semiconductor memory circuits and subsystems.
• 2. Identify various fault models, modes and mechanisms in semiconductor memories and their testing procedures.
• 3. Know, how of the state-of-the-art memory chip design

UNIT - I

Random Access Memory Technologies: Static Random-Access Memories (SRAMs), SRAM Cell Structures, MOS SRAM Architecture, MOS SRAM Cell and Peripheral Circuit, Bipolar SRAM, Advanced SRAM Architectures, Application Specific SRAMs.

UNIT - II

DRAMs, MOS DRAM Cell, BiCMOS DRAM, Error Failures in DRAM, Advanced DRAM Design and Architecture, Application Specific DRAMs, SRAM and DRAM Memory controllers.

UNIT - III

Non-Volatile Memories: Masked ROMs, PROMs, Bipolar & CMOS PROM, EEPROMs, Floating Gate EPROM Cell, OTP EPROM, EEPROMs, Non-volatile SRAM, Flash Memories.

UNIT - IV

Advanced Memory Technologies and High-density Memory Packing Technologies: Ferroelectric Random-Access Memories (FRAMs), Gallium Arsenide (GaAs) FRAMs, Analog Memories, Magneto Resistive Random-Access Memories (MRAMs), Experimental Memory Devices.

UNIT - V

Memory Hybrids (2D & 3D), Memory Stacks, Memory Testing and Reliability Issues, Memory Cards, High Density Memory Packaging.

TEXT BOOKS:

• 1. Ashok K Sharma, “Advanced Semiconductor Memories: Architectures, Designs and Applications”, Wiley Interscience
• 2. Kiyoo Itoh, “VLSI memory chip design”, Springer International Ed.

REFERENCE BOOK:

• 1. Ashok K Sharma,” Semiconductor Memories: Technology, Testing and Reliability, PHI M.TECH.- I YEAR- I SEMESTER EMBEDDED SYSTEMS & VLSI DESIGN/VLSI & EMBEDDED SYSTEMS