JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD

Course Objectives:

• 1. To understand the MEMS based technologies in Microwave and millimeter system.
• 2. To known the use of RF switches, tunable capacitors and micro inductors
• 3. To understand the principle of Phase shifters, Micromechanical filters.

Course Outcomes

Students will be able to:

• 1. Known high precision technologies for which micromachining offers a vible route
• 2. Utilize the RF switches, tunable capacitors and micro inductors.
• 3. Design a MEMS based Phase shifters, Micromechanical filters
• 4. Choose Proper Micromachined antennae.

UNIT - I

Microelectromechanical systems (MEMS) and Radio Frequency MEMS: Introduction, Microfabrications for MEMS, Electromechanical transducers, Microsensing for MEMS, Materials for MEMS MEMS material: Thin films for MEMS and their deposition techniques, Materials for polymer MEMS

UNIT - II

RF MEMS switches and Micro relays: Switch parameters, Basics of switching, Switches for RF and Microwave Applications, Actuation mechanisms for MEMS devices, Bistable micro relays and microactuators, Dynamics of the switch operation, MEMS switch design, modeling and evaluation, MEMS switch design considerations, MEMS inductors, MEMS capacitors. .

UNIT - III

Micromachined RF filters: Modeling of mechanical filters, Micromechanical filters, Surface acoustic wave filters, Bulk acoustic wave filters, Micromachined filters for millimeter wave frequencies Micromachined Phase Shifters: Types and limitations, MEMS phase shifters, Ferroelectric Phase Shifters.

UNIT - IV

Micromachined transmission lines and components: Micromachined transmission lines, Design, fabrication and measurement Micromachined antennae: Overview of Microstrip antennae, Micromachining techniques to improve antenna performance, Micromachining as a fabrication process for small antennae, Micromachined reconfigurable antennae.

UNIT - V

Integration and packaging for RF MEMS devices: Role of MEMs packages, types of MEMS packages, Flip-flop assembly, Multichip module packaging, RF MEMS packaging., Thermal issues.

TEXT BOOK:

• 1. Vijay K. Varadan, K.J. Vinoy, K.A.Jose - RF MEMS and Their Applications, John Wiley & Sons

REFERENCE BOOKS:

• 1. Rebeiz, G.M. -MEMS: Theory Design and Technology, John Wiley & Sons.2002
• 2. De Los Santos, H.J.-RF MEMS circuit Design for Wireless Communications, Artech House, 1999
• 3. An introduction to MEMS, PRIME Faraday Partnership, Loughborough University 2002 M.TECH.- II YEAR- III SEMESTER MICROWAVE AND RADAR ENGINEERING